Publication Information

{'id': 'https://openalex.org/W1976936912', 'doi': 'https://doi.org/10.1049/ir:20041205', 'title': 'Got to get a packet or two [stacked multilayer chip assemblies]', 'display_name': 'Got to get a packet or two [stacked multilayer chip assemblies]', 'publication_year': 2004, 'publication_date': '2004-12-01', 'ids': {'openalex': 'https://openalex.org/W1976936912', 'doi': 'https://doi.org/10.1049/ir:20041205', 'mag': '1976936912'}, 'language': 'en', 'primary_location': {'is_oa': False, 'landing_page_url': 'https://doi.org/10.1049/ir:20041205', 'pdf_url': None, 'source': {'id': 'https://openalex.org/S103178497', 'display_name': 'IEE Review', 'issn_l': '0953-5683', 'issn': ['0953-5683', '1741-0495'], 'is_oa': False, 'is_in_doaj': False, 'is_core': False, 'host_organization': 'https://openalex.org/P4310311714', 'host_organization_name': 'Institution of Engineering and Technology', 'host_organization_lineage': ['https://openalex.org/P4310311714'], 'host_organization_lineage_names': ['Institution of Engineering and Technology'], 'type': 'journal'}, 'license': None, 'license_id': None, 'version': None, 'is_accepted': False, 'is_published': False}, 'type': 'article', 'type_crossref': 'journal-article', 'indexed_in': ['crossref'], 'open_access': {'is_oa': False, 'oa_status': 'closed', 'oa_url': None, 'any_repository_has_fulltext': False}, 'authorships': [{'author_position': 'first', 'author': {'id': 'https://openalex.org/A5033030551', 'display_name': 'C. Evans-Pughe', 'orcid': None}, 'institutions': [], 'countries': [], 'is_corresponding': True, 'raw_author_name': 'C. Evans-Pughe', 'raw_affiliation_strings': [], 'affiliations': []}], 'institution_assertions': [], 'countries_distinct_count': 0, 'institutions_distinct_count': 0, 'corresponding_author_ids': ['https://openalex.org/A5033030551'], 'corresponding_institution_ids': [], 'apc_list': None, 'apc_paid': None, 'fwci': 0.317, 'has_fulltext': True, 'fulltext_origin': 'ngrams', 'cited_by_count': 1, 'citation_normalized_percentile': {'value': 0.47275, 'is_in_top_1_percent': False, 'is_in_top_10_percent': False}, 'cited_by_percentile_year': {'min': 61, 'max': 68}, 'biblio': {'volume': '50', 'issue': '12', 'first_page': '40', 'last_page': '43'}, 'is_retracted': False, 'is_paratext': False, 'primary_topic': {'id': 'https://openalex.org/T11527', 'display_name': 'Three-Dimensional Integrated Circuits', 'score': 0.9879, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, 'topics': [{'id': 'https://openalex.org/T11527', 'display_name': 'Three-Dimensional Integrated Circuits', 'score': 0.9879, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, {'id': 'https://openalex.org/T10829', 'display_name': 'Networks on Chip in System-on-Chip Design', 'score': 0.978, 'subfield': {'id': 'https://openalex.org/subfields/1705', 'display_name': 'Computer Networks and Communications'}, 'field': {'id': 'https://openalex.org/fields/17', 'display_name': 'Computer Science'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}], 'keywords': [{'id': 'https://openalex.org/keywords/system-in-package', 'display_name': 'System in package', 'score': 0.7898821}, {'id': 'https://openalex.org/keywords/chip-stacking', 'display_name': 'Chip Stacking', 'score': 0.567989}, {'id': 'https://openalex.org/keywords/system-integration', 'display_name': 'System Integration', 'score': 0.53642}, {'id': 'https://openalex.org/keywords/system-on-chip', 'display_name': 'System-on-Chip', 'score': 0.536032}, {'id': 'https://openalex.org/keywords/networks-on-chip', 'display_name': 'Networks on Chip', 'score': 0.508122}], 'concepts': [{'id': 'https://openalex.org/C123745756', 'wikidata': 'https://www.wikidata.org/wiki/Q1665949', 'display_name': 'Interconnection', 'level': 2, 'score': 0.81123054}, {'id': 'https://openalex.org/C146667757', 'wikidata': 'https://www.wikidata.org/wiki/Q1457198', 'display_name': 'System in package', 'level': 3, 'score': 0.7898821}, {'id': 'https://openalex.org/C165005293', 'wikidata': 'https://www.wikidata.org/wiki/Q1074500', 'display_name': 'Chip', 'level': 2, 'score': 0.62834084}, {'id': 'https://openalex.org/C88548561', 'wikidata': 'https://www.wikidata.org/wiki/Q347599', 'display_name': 'sort', 'level': 2, 'score': 0.5821048}, {'id': 'https://openalex.org/C37977207', 'wikidata': 'https://www.wikidata.org/wiki/Q175561', 'display_name': 'Microelectromechanical systems', 'level': 2, 'score': 0.5560262}, {'id': 'https://openalex.org/C158379750', 'wikidata': 'https://www.wikidata.org/wiki/Q214111', 'display_name': 'Network packet', 'level': 2, 'score': 0.5227066}, {'id': 'https://openalex.org/C41008148', 'wikidata': 'https://www.wikidata.org/wiki/Q21198', 'display_name': 'Computer science', 'level': 0, 'score': 0.5036997}, {'id': 'https://openalex.org/C149635348', 'wikidata': 'https://www.wikidata.org/wiki/Q193040', 'display_name': 'Embedded system', 'level': 1, 'score': 0.47500002}, {'id': 'https://openalex.org/C2777289219', 'wikidata': 'https://www.wikidata.org/wiki/Q7632154', 'display_name': 'Substrate (aquarium)', 'level': 2, 'score': 0.46912098}, {'id': 'https://openalex.org/C9390403', 'wikidata': 'https://www.wikidata.org/wiki/Q3966', 'display_name': 'Computer hardware', 'level': 1, 'score': 0.3708567}, {'id': 'https://openalex.org/C118524514', 'wikidata': 'https://www.wikidata.org/wiki/Q173212', 'display_name': 'Computer architecture', 'level': 1, 'score': 0.36659017}, {'id': 'https://openalex.org/C24326235', 'wikidata': 'https://www.wikidata.org/wiki/Q126095', 'display_name': 'Electronic engineering', 'level': 1, 'score': 0.35553604}, {'id': 'https://openalex.org/C192562407', 'wikidata': 'https://www.wikidata.org/wiki/Q228736', 'display_name': 'Materials science', 'level': 0, 'score': 0.3412705}, {'id': 'https://openalex.org/C127413603', 'wikidata': 'https://www.wikidata.org/wiki/Q11023', 'display_name': 'Engineering', 'level': 0, 'score': 0.31470978}, {'id': 'https://openalex.org/C49040817', 'wikidata': 'https://www.wikidata.org/wiki/Q193091', 'display_name': 'Optoelectronics', 'level': 1, 'score': 0.23918012}, {'id': 'https://openalex.org/C31258907', 'wikidata': 'https://www.wikidata.org/wiki/Q1301371', 'display_name': 'Computer network', 'level': 1, 'score': 0.21366465}, {'id': 'https://openalex.org/C76155785', 'wikidata': 'https://www.wikidata.org/wiki/Q418', 'display_name': 'Telecommunications', 'level': 1, 'score': 0.18632829}, {'id': 'https://openalex.org/C111368507', 'wikidata': 'https://www.wikidata.org/wiki/Q43518', 'display_name': 'Oceanography', 'level': 1, 'score': 0.0}, {'id': 'https://openalex.org/C23123220', 'wikidata': 'https://www.wikidata.org/wiki/Q816826', 'display_name': 'Information retrieval', 'level': 1, 'score': 0.0}, {'id': 'https://openalex.org/C127313418', 'wikidata': 'https://www.wikidata.org/wiki/Q1069', 'display_name': 'Geology', 'level': 0, 'score': 0.0}], 'mesh': [], 'locations_count': 1, 'locations': [{'is_oa': False, 'landing_page_url': 'https://doi.org/10.1049/ir:20041205', 'pdf_url': None, 'source': {'id': 'https://openalex.org/S103178497', 'display_name': 'IEE Review', 'issn_l': '0953-5683', 'issn': ['0953-5683', '1741-0495'], 'is_oa': False, 'is_in_doaj': False, 'is_core': False, 'host_organization': 'https://openalex.org/P4310311714', 'host_organization_name': 'Institution of Engineering and Technology', 'host_organization_lineage': ['https://openalex.org/P4310311714'], 'host_organization_lineage_names': ['Institution of Engineering and Technology'], 'type': 'journal'}, 'license': None, 'license_id': None, 'version': None, 'is_accepted': False, 'is_published': False}], 'best_oa_location': None, 'sustainable_development_goals': [], 'grants': [], 'datasets': [], 'versions': [], 'referenced_works_count': 0, 'referenced_works': [], 'related_works': ['https://openalex.org/W2972254340', 'https://openalex.org/W2543122780', 'https://openalex.org/W2361805396', 'https://openalex.org/W2272290532', 'https://openalex.org/W2120483398', 'https://openalex.org/W2023632158', 'https://openalex.org/W2018755015', 'https://openalex.org/W2017814390', 'https://openalex.org/W1763916368', 'https://openalex.org/W1604487289'], 'abstract_inverted_index': {'System': [0], 'in': [1, 65], 'package': [2], '(SiP),': [3], 'as': [4], 'it': [5], 'is': [6, 9, 30], 'being': [7], 'called,': [8], 'a': [10, 25, 40, 46], 'combination': [11], 'of': [12, 33], 'two': [13], 'or': [14, 44], 'more': [15], 'die': [16], 'stacked': [17], 'together': [18], 'on': [19], 'an': [20], 'interconnection': [21], 'substrate,': [22], 'all': [23, 56], 'within': [24], 'single': [26], 'package.': [27], 'Typically,': [28], 'there': [29], 'some': [31], 'sort': [32], 'processor': [34], 'chip': [35], 'coupled': [36], 'to': [37, 45], 'either': [38], 'memory,': [39], 'high-performance': [41], 'analogue': [42], 'IC,': [43], 'micro-electro-mechanical': [47], 'system': [48], '(MEMS)': [49], 'device.': [50], 'A': [51], 'SiP,': [52], 'though,': [53], 'could': [54], 'contain': [55], 'these': [57], 'elements.': [58], 'This': [59], 'article': [60], 'discusses': [61], 'the': [62], 'challenges': [63], 'faced': [64], 'SiP': [66], 'technology.': [67]}, 'cited_by_api_url': 'https://api.openalex.org/works?filter=cites:W1976936912', 'counts_by_year': [], 'updated_date': '2024-09-25T22:00:52.549259', 'created_date': '2016-06-24'}