Title: A first report of cyclic grain boundary migration during high temperature fatigue
Abstract: In High-Cycle Fatigue (HCF) of materials like copper, the most common failure modes originate from cyclic strain localization in persistent slip bands (PSBs). The latter form only when the loading amplitudes exceed the PSB thresholds. In contrast to this well-known HCF behaviour, it is shown in the present study that fatigue damage (cyclic strain localization, surface roughening, stage I crack initiation) develops even at loading amplitudes well below the PSB threshold in copper subjected to UltraHigh-Cycle Fatigue (UHCF). These findings are attributed to the accumulation of very small cyclic slip irreversibilities over very large numbers of cycles (>1010).
Publication Year: 1979
Publication Date: 1979-12-01
Language: en
Type: article
Indexed In: ['crossref']
Access and Citation
Cited By Count: 19
AI Researcher Chatbot
Get quick answers to your questions about the article from our AI researcher chatbot