Title: A Creep Constitutive Model of Dislocation Thermal Activation
Abstract: A new creep constitutive model of dislocation thermal activation has been established in this investigation based on the creep test results, i.e., the creep rate first decreased with creep deformation until a minimum creep rate reached, and then increased with further creep deformation. The constant stress and stress change creep tests of Inconel 718 has been carried out in the stress range of 491 to 856 MPa at 650° C. The experimental results have shown that this model can characterize the creep deformation behaviour of Inconel 718 under the creep test condition used in present investigation.
Publication Year: 1990
Publication Date: 1990-01-01
Language: en
Type: book-chapter
Indexed In: ['crossref']
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Cited By Count: 1
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