Abstract: This topic is Thru Silicon Via interface for DRAM. This part will explain why TSV is necessary in DRAM, the advantages of DRAM with TSV, the TSV DRAM types and the issues and solutions for the TSV DRAM.
Publication Year: 2013
Publication Date: 2013-10-26
Language: en
Type: book-chapter
Indexed In: ['crossref']
Access and Citation
AI Researcher Chatbot
Get quick answers to your questions about the article from our AI researcher chatbot