Abstract: This chapter presents comparisons between planar architectures that use silicon back-end wiring technologies that essentially represent the upper end of the I/O/mm/layer spectrum and offer silicon-level connectivity on package. Embedded multi-die interconnect bridge (EMIB) is a planar dense multi-chip packages technology, where the basic concept is that it uses thin pieces of silicon with multilayer back-end-of-line interconnects, embedded in organic substrates, to enable dense die-to-die interconnects. The chapter describes the EMIB technology architecture and the high level EMIB process flow followed by a discussion of the high bandwidth envelope. It focuses on the electrical signaling performance of EMIB. Typically EMIB is used to connect two adjacent dies. This results in a relatively short I/O channel that does not demand complex transceiver circuits to meet signal integrity requirements. The chapter also presents results from eye diagram simulations to demonstrate that the I/O channel and circuits can meet signal integrity requirements.
Publication Year: 2019
Publication Date: 2019-01-18
Language: en
Type: other
Indexed In: ['crossref']
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Cited By Count: 11
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