Publication Information

{'id': 'https://openalex.org/W2990622264', 'doi': 'https://doi.org/10.1002/9783527603978.mst0477', 'title': 'Etching of Semiconductor Devices', 'display_name': 'Etching of Semiconductor Devices', 'publication_year': 2019, 'publication_date': '2019-11-19', 'ids': {'openalex': 'https://openalex.org/W2990622264', 'doi': 'https://doi.org/10.1002/9783527603978.mst0477', 'mag': '2990622264'}, 'language': 'en', 'primary_location': {'is_oa': False, 'landing_page_url': 'https://doi.org/10.1002/9783527603978.mst0477', 'pdf_url': None, 'source': {'id': 'https://openalex.org/S82336448', 'display_name': 'Materials Science and Technology', 'issn_l': '0267-0836', 'issn': ['0267-0836', '1743-2847'], 'is_oa': False, 'is_in_doaj': False, 'is_core': True, 'host_organization': 'https://openalex.org/P4310320442', 'host_organization_name': 'Maney Publishing', 'host_organization_lineage': ['https://openalex.org/P4310320442'], 'host_organization_lineage_names': ['Maney Publishing'], 'type': 'journal'}, 'license': None, 'license_id': None, 'version': None, 'is_accepted': False, 'is_published': False}, 'type': 'other', 'type_crossref': 'other', 'indexed_in': ['crossref'], 'open_access': {'is_oa': False, 'oa_status': 'closed', 'oa_url': None, 'any_repository_has_fulltext': False}, 'authorships': [{'author_position': 'first', 'author': {'id': 'https://openalex.org/A5036730965', 'display_name': 'Thorsten Lill', 'orcid': 'https://orcid.org/0000-0001-8668-5247'}, 'institutions': [{'id': 'https://openalex.org/I4210139090', 'display_name': 'Lam Research (United States)', 'ror': 'https://ror.org/04gecbm52', 'country_code': 'US', 'type': 'company', 'lineage': ['https://openalex.org/I4210139090']}], 'countries': ['US'], 'is_corresponding': False, 'raw_author_name': 'Thorsten Lill', 'raw_affiliation_strings': ['Lam Research Corp Fremont CA USA'], 'affiliations': [{'raw_affiliation_string': 'Lam Research Corp Fremont CA USA', 'institution_ids': ['https://openalex.org/I4210139090']}]}, {'author_position': 'middle', 'author': {'id': 'https://openalex.org/A5003799984', 'display_name': 'V. Vahedi', 'orcid': 'https://orcid.org/0000-0001-5678-6995'}, 'institutions': [{'id': 'https://openalex.org/I4210139090', 'display_name': 'Lam Research (United States)', 'ror': 'https://ror.org/04gecbm52', 'country_code': 'US', 'type': 'company', 'lineage': ['https://openalex.org/I4210139090']}], 'countries': ['US'], 'is_corresponding': False, 'raw_author_name': 'Vahid Vahedi', 'raw_affiliation_strings': ['Lam Research Corp Fremont CA USA'], 'affiliations': [{'raw_affiliation_string': 'Lam Research Corp Fremont CA USA', 'institution_ids': ['https://openalex.org/I4210139090']}]}, {'author_position': 'last', 'author': {'id': 'https://openalex.org/A5019329564', 'display_name': 'Richard A. Gottscho', 'orcid': 'https://orcid.org/0000-0001-7484-5223'}, 'institutions': [{'id': 'https://openalex.org/I4210139090', 'display_name': 'Lam Research (United States)', 'ror': 'https://ror.org/04gecbm52', 'country_code': 'US', 'type': 'company', 'lineage': ['https://openalex.org/I4210139090']}], 'countries': ['US'], 'is_corresponding': False, 'raw_author_name': 'Richard A. Gottscho', 'raw_affiliation_strings': ['Lam Research Corp Fremont CA USA'], 'affiliations': [{'raw_affiliation_string': 'Lam Research Corp Fremont CA USA', 'institution_ids': ['https://openalex.org/I4210139090']}]}], 'institution_assertions': [], 'countries_distinct_count': 1, 'institutions_distinct_count': 1, 'corresponding_author_ids': [], 'corresponding_institution_ids': [], 'apc_list': None, 'apc_paid': None, 'fwci': None, 'has_fulltext': False, 'cited_by_count': 4, 'citation_normalized_percentile': {'value': 0.813433, 'is_in_top_1_percent': False, 'is_in_top_10_percent': False}, 'cited_by_percentile_year': {'min': 77, 'max': 79}, 'biblio': {'volume': None, 'issue': None, 'first_page': '1', 'last_page': '25'}, 'is_retracted': False, 'is_paratext': False, 'primary_topic': {'id': 'https://openalex.org/T10472', 'display_name': 'Semiconductor materials and devices', 'score': 0.9999, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, 'topics': [{'id': 'https://openalex.org/T10472', 'display_name': 'Semiconductor materials and devices', 'score': 0.9999, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, {'id': 'https://openalex.org/T10781', 'display_name': 'Plasma Diagnostics and Applications', 'score': 0.9998, 'subfield': {'id': 'https://openalex.org/subfields/2208', 'display_name': 'Electrical and Electronic Engineering'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}, {'id': 'https://openalex.org/T10377', 'display_name': 'Metal and Thin Film Mechanics', 'score': 0.9986, 'subfield': {'id': 'https://openalex.org/subfields/2211', 'display_name': 'Mechanics of Materials'}, 'field': {'id': 'https://openalex.org/fields/22', 'display_name': 'Engineering'}, 'domain': {'id': 'https://openalex.org/domains/3', 'display_name': 'Physical Sciences'}}], 'keywords': [{'id': 'https://openalex.org/keywords/dry-etching', 'display_name': 'Dry etching', 'score': 0.8287082}, {'id': 'https://openalex.org/keywords/plasma-etching', 'display_name': 'Plasma Etching', 'score': 0.46542045}], 'concepts': [{'id': 'https://openalex.org/C100460472', 'wikidata': 'https://www.wikidata.org/wiki/Q2368605', 'display_name': 'Etching (microfabrication)', 'level': 3, 'score': 0.8841416}, {'id': 'https://openalex.org/C130472188', 'wikidata': 'https://www.wikidata.org/wiki/Q1640159', 'display_name': 'Reactive-ion etching', 'level': 4, 'score': 0.88409555}, {'id': 'https://openalex.org/C1291036', 'wikidata': 'https://www.wikidata.org/wiki/Q1191918', 'display_name': 'Dry etching', 'level': 4, 'score': 0.8287082}, {'id': 'https://openalex.org/C160671074', 'wikidata': 'https://www.wikidata.org/wiki/Q267131', 'display_name': 'Wafer', 'level': 2, 'score': 0.80231804}, {'id': 'https://openalex.org/C192562407', 'wikidata': 'https://www.wikidata.org/wiki/Q228736', 'display_name': 'Materials science', 'level': 0, 'score': 0.7426159}, {'id': 'https://openalex.org/C171250308', 'wikidata': 'https://www.wikidata.org/wiki/Q11468', 'display_name': 'Nanotechnology', 'level': 1, 'score': 0.5903727}, {'id': 'https://openalex.org/C108225325', 'wikidata': 'https://www.wikidata.org/wiki/Q11456', 'display_name': 'Semiconductor', 'level': 2, 'score': 0.57434857}, {'id': 'https://openalex.org/C107187091', 'wikidata': 'https://www.wikidata.org/wiki/Q2392011', 'display_name': 'Plasma etching', 'level': 4, 'score': 0.46542045}, {'id': 'https://openalex.org/C49040817', 'wikidata': 'https://www.wikidata.org/wiki/Q193091', 'display_name': 'Optoelectronics', 'level': 1, 'score': 0.458903}, {'id': 'https://openalex.org/C61696701', 'wikidata': 'https://www.wikidata.org/wiki/Q770766', 'display_name': 'Engineering physics', 'level': 1, 'score': 0.3486681}, {'id': 'https://openalex.org/C2779227376', 'wikidata': 'https://www.wikidata.org/wiki/Q6505497', 'display_name': 'Layer (electronics)', 'level': 2, 'score': 0.33323175}, {'id': 'https://openalex.org/C127413603', 'wikidata': 'https://www.wikidata.org/wiki/Q11023', 'display_name': 'Engineering', 'level': 0, 'score': 0.10591692}], 'mesh': [], 'locations_count': 1, 'locations': [{'is_oa': False, 'landing_page_url': 'https://doi.org/10.1002/9783527603978.mst0477', 'pdf_url': None, 'source': {'id': 'https://openalex.org/S82336448', 'display_name': 'Materials Science and Technology', 'issn_l': '0267-0836', 'issn': ['0267-0836', '1743-2847'], 'is_oa': False, 'is_in_doaj': False, 'is_core': True, 'host_organization': 'https://openalex.org/P4310320442', 'host_organization_name': 'Maney Publishing', 'host_organization_lineage': ['https://openalex.org/P4310320442'], 'host_organization_lineage_names': ['Maney Publishing'], 'type': 'journal'}, 'license': None, 'license_id': None, 'version': None, 'is_accepted': False, 'is_published': False}], 'best_oa_location': None, 'sustainable_development_goals': [{'score': 0.44, 'id': 'https://metadata.un.org/sdg/7', 'display_name': 'Affordable and clean energy'}], 'grants': [], 'datasets': [], 'versions': [], 'referenced_works_count': 66, 'referenced_works': ['https://openalex.org/W1876337511', 'https://openalex.org/W1964560403', 'https://openalex.org/W1965148421', 'https://openalex.org/W1965674380', 'https://openalex.org/W1975154087', 'https://openalex.org/W1977163085', 'https://openalex.org/W1979574522', 'https://openalex.org/W1982130714', 'https://openalex.org/W1984697825', 'https://openalex.org/W1987600079', 'https://openalex.org/W2000065152', 'https://openalex.org/W2010807491', 'https://openalex.org/W2011400472', 'https://openalex.org/W2015171250', 'https://openalex.org/W2017278507', 'https://openalex.org/W2033182420', 'https://openalex.org/W2033599397', 'https://openalex.org/W2034539959', 'https://openalex.org/W2034765822', 'https://openalex.org/W2041143206', 'https://openalex.org/W2044924796', 'https://openalex.org/W2046836154', 'https://openalex.org/W2050904462', 'https://openalex.org/W2051483114', 'https://openalex.org/W2052698079', 'https://openalex.org/W2059997046', 'https://openalex.org/W2061519262', 'https://openalex.org/W2068123513', 'https://openalex.org/W2069397525', 'https://openalex.org/W2080001939', 'https://openalex.org/W2083877606', 'https://openalex.org/W2085090583', 'https://openalex.org/W2085517752', 'https://openalex.org/W2085900121', 'https://openalex.org/W2087846290', 'https://openalex.org/W2091355792', 'https://openalex.org/W2094529056', 'https://openalex.org/W2095567118', 'https://openalex.org/W2127212879', 'https://openalex.org/W2144022251', 'https://openalex.org/W2150109955', 'https://openalex.org/W2158932701', 'https://openalex.org/W2238541107', 'https://openalex.org/W2326313728', 'https://openalex.org/W2396514757', 'https://openalex.org/W2483443490', 'https://openalex.org/W2492640099', 'https://openalex.org/W2493880907', 'https://openalex.org/W2528766955', 'https://openalex.org/W2569654522', 'https://openalex.org/W2570476739', 'https://openalex.org/W2585010444', 'https://openalex.org/W2594473513', 'https://openalex.org/W2604019671', 'https://openalex.org/W2605053466', 'https://openalex.org/W2616982892', 'https://openalex.org/W2621055098', 'https://openalex.org/W2622946377', 'https://openalex.org/W2738924991', 'https://openalex.org/W2751659282', 'https://openalex.org/W2756461855', 'https://openalex.org/W2771102513', 'https://openalex.org/W2788055577', 'https://openalex.org/W2791068257', 'https://openalex.org/W2801260657', 'https://openalex.org/W3112429341'], 'related_works': ['https://openalex.org/W4387743859', 'https://openalex.org/W2765886561', 'https://openalex.org/W2495723748', 'https://openalex.org/W2389091192', 'https://openalex.org/W2100954478', 'https://openalex.org/W2094633807', 'https://openalex.org/W2045553774', 'https://openalex.org/W2035159056', 'https://openalex.org/W1991288435', 'https://openalex.org/W19452786'], 'abstract_inverted_index': {'Abstract': [0], 'Plasma': [1], 'etching': [2, 6, 25, 44, 50, 59, 76, 105, 113, 154, 171], 'or': [3, 119], 'reactive': [4], 'ion': [5, 57], '(RIE)': [7], 'has': [8], 'been': [9], 'the': [10, 18, 41, 86, 94, 97, 132, 152, 163, 166], 'workhorse': [11], 'for': [12, 66, 151], 'patterning': [13], 'of': [14, 33, 74, 112, 134, 139, 168], 'semiconductor': [15, 80, 169], 'devices': [16], 'since': [17], 'early': [19], '1980s': [20], 'when': [21], 'it': [22], 'replaced': [23], 'wet': [24], 'in': [26, 79, 143], 'manufacturing.': [27, 81], 'Today,': [28], 'RIE': [29, 144], 'is': [30, 84, 141], 'reaching': [31], 'levels': [32], 'performance': [34, 95], 'that': [35], 'were': [36], 'unimaginable': [37], 'back': [38], 'then.': [39], 'At': [40], 'same': [42], 'time,': [43], 'technologies': [45, 77, 155], 'such': [46, 115], 'as': [47, 116], 'atomic': [48], 'layer': [49], '(ALE),': [51], 'radical': [52], 'dry': [53, 75], 'vapor': [54], 'etching,': [55], 'and': [56, 90, 156], 'beam': [58], 'are': [60], 'finding': [61], 'their': [62], 'way': [63], 'into': [64, 126, 165], 'manufacturing': [65], 'certain': [67], 'applications.': [68], 'Herein,': [69], 'we': [70, 122], 'present': [71], 'an': [72], 'overview': [73], 'used': [78], 'The': [82, 136], 'emphasis': [83], 'on': [85, 96], 'elementary': [87], 'surface': [88], 'processes': [89], 'how': [91], 'they': [92], 'impact': [93], 'wafer.': [98], 'We': [99], 'will': [100, 159, 172], 'start': [101], 'from': [102], 'less': [103], 'complex': [104], 'technologies,': [106], 'which': [107, 129], 'use': [108], 'just': [109], 'one': [110], 'kind': [111], 'species,': [114], 'neutrals,': [117], 'radicals,': [118], 'ions.': [120], 'Then': [121], 'combine': [123], 'these': [124], 'techniques': [125], 'cycling': [127], 'processes,': [128], 'leads': [130], 'to': [131], 'discussion': [133], 'ALE.': [135], 'highest': [137], 'level': [138], 'complexity': [140], 'reached': [142], 'with': [145], 'simultaneous': [146], 'species': [147], 'fluxes.': [148], 'Reactor': [149], 'designs': [150], 'various': [153], 'process': [157], 'control': [158], 'be': [160, 173], 'covered.': [161], 'Finally,': [162], 'outlook': [164], 'future': [167], 'device': [170], 'given.': [174]}, 'cited_by_api_url': 'https://api.openalex.org/works?filter=cites:W2990622264', 'counts_by_year': [{'year': 2024, 'cited_by_count': 1}, {'year': 2021, 'cited_by_count': 3}], 'updated_date': '2024-12-15T05:56:45.339791', 'created_date': '2019-12-05'}